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1PC IC Chip BGA Reballing Stencil Kit Solder Template for iPhone XS MAX/11 Pro/11 Max/XS/XR Motherboard

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Product Details
Product Details

Description:
OOTDTY100% brand new and high quality
Feature:
It is suitable for iPhone XS MAX/11 Pro/11 Max/XS/XR.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
It is easy to use no matter you are a new or expert.
Reballing Stencil only, other accessories demo in the picture is not included!

Specifications:
Item Type: Reballing Stencil
Material: Steel
Size: 195x79mm/7.6×3.1in
Color: Silver
Optional Type: A, B, C, D, E
Compatible models: for iPhone XS MAX/11 Pro/11 Max/XS/XR
Quantity: 1 PC

Note:
Transition: 1cm=10mm=0.39inch
Please allow 0-1cm error due to manual measurement. pls make sure you do not mind before you bid.
Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!

Package Includes:(Optional)
1 x BGA Reballing Stencil for iPhone XS MAX
1 x BGA Reballing Stencil for iPhone 11 Pro
1 x BGA Reballing Stencil for iPhone 11 Max
1 x BGA Reballing Stencil for iPhone XS
1 x BGA Reballing Stencil for iPhone XR








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