Description:
OOTDTY100% brand new and high quality
Feature:
We have all size of solder ball, including leaded solder ball 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.6/0.65/0.75mm.
Solder (Tin) paste is the best choice of reballing IC.
It is used instead of the pin in the IC component package structure.
Widely used in tinplate, flux, organic synthesis, chemical production, alloy manufacturing, and assembly of multiple integrated circuits in the electronics industry.
BGA Reballing Balls with Storage Box only, other accessories demo in the picture is not included!
Specifications:
Item Type: BGA Reballing Balls
Size: diameter: 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.6/0.65/0.75mm
Color: As shown
Quantity: 2.5w PCS per bottle
Balls Alloy: Sn63/Pb37
Quantity: 1 Set(11 Bottle)
Note:
Transition: 1cm=10mm=0.39inch
Please allow 0-1cm error due to manual measurement. pls make sure you do not mind before you bid.
Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!
Package Includes:
11 Bottle x BGA Reballing Balls
1 x Storage Box
